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Solidtrons
Frequently Asked Questions
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What is a Solidtron?
A Solidtron is a miniature 3 junction solid state switch which
features an ultra-fast turn-on with high di/dt and peak current
capabilities. Combine that with low conduction losses and
Solidtrons become ideally suited for fast pulse discharge
applications. Solidtrons have two distinct varieties - Voltage
Controlled (VCS) and Current Controlled (CCS), each with its own
unique advantages.
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What are some of the Applications for a
Solidtron?
Solidtrons maybe used in most pulse discharge applications. The
largest use is presently in weapon fuze systems. Other applications
include, motor ignition, crowbar systems, replacement of bulky gas
or vacuum switches in various H.V. power supplies, flash lamps and certain
medical equipment.
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What is the difference between a current controlled (CCS) and a
Voltage Controlled (VCS) Solidtron?
The difference is in the gate structure of the device. VCS devices
have a MOS or insulated gate giving it fast turn-on (50ns turn-on
delay). It requires that the gate have negative bias to keep the
device in the OFF-state. The CCS devices have a traditional junction
gate, like that on an SCR. This makes the gates extremely rugged and
only requires a gate-cathode shorting resistor to remain in the
OFF-state. CCS devices are comparatively slower (120ns turn-on
delay) but have higher anode-cathode break down voltage.
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What is a ThinPak® Package?
It is an alternative method of packaging semiconductor devices when
compared to the traditional method of using wire-bonds.
The process of “ThinPaking” a device involves soldering a ceramic
“lid” which has patterned metal bonded on either side of it to the
solderable metal pattern on top of the semi-conductor die. The
interconnection between the top metal on the die and the top side of
the “lid” is achieved using a number of vias within the ceramic lid.
This allows for a high current connection to the top of the die
using a thick (~10 mils) copper bus bar, which is directly soldered
or pressed to the top of the ceramic lid. The ThinPak® allows a
number of benefits over wire-bonded packages: Very low parasitic
inductance, high current interconnect, small foot print and low
thermal resistance just to name a few.
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